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PCA82C250
CAN controller interface
Rev. 06 -- 26 March 2009 Product data sheet
1. General description
The PCA82C250 is the interface between a CAN protocol controller and the physical bus. The device provides differential transmit capability to the bus and differential receive capability to the CAN controller.
2. Features
I I I I I I I I I I Fully compatible with the "ISO 11898" standard High speed (up to 1 MBd) Bus lines protected against transients in an automotive environment Slope control to reduce Radio Frequency Interference (RFI) Differential receiver with wide common-mode range for high immunity against ElectroMagnetic Interference (EMI) Thermally protected Short-circuit proof to battery and ground Low-current Standby mode An unpowered node does not disturb the bus lines At least 110 nodes can be connected
3. Applications
I High-speed automotive applications (up to 1 MBd).
4. Quick reference data
Table 1. Symbol VCC ICC 1/tbit VCAN Vdiff tPD Tamb Quick reference data Parameter supply voltage supply current maximum transmission speed CANH, CANL input/output voltage differential bus voltage propagation delay ambient temperature High-speed mode Standby mode non-return-to-zero Conditions Min 4.5 1 -8 1.5 -40 Max 5.5 170 +18 3.0 50 +125 Unit V A MBd V V ns C
NXP Semiconductors
PCA82C250
CAN controller interface
5. Ordering information
Table 2. Ordering information Package Name PCA82C250T SO8 Description plastic small outline package; 8 leads; body width 3.9 mm Version SOT96-1 Type number
6. Block diagram
VCC 3
TXD
1
PROTECTION
Rs
8
SLOPE/ STANDBY
DRIVER HS 7 CANH
RXD
4
RECEIVER 6 CANL
Vref
5
REFERENCE VOLTAGE
PCA82C250
2 GND
mka669
Fig 1.
Block diagram
7. Pinning information
7.1 Pinning
TXD 1 GND 2
8 Rs 7 CANH CANL Vref
PCA82C250
VCC RXD 3 4
mka670
6 5
Fig 2.
Pin configuration
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7.2 Pin description
Table 3. Symbol TXD GND VCC RXD Vref CANL CANH Rs Pin description Pin 1 2 3 4 5 6 7 8 Description transmit data input ground supply voltage receive data output reference voltage output LOW-level CAN voltage input/output HIGH-level CAN voltage input/output slope resistor input
8. Functional description
The PCA82C250 is the interface between a CAN protocol controller and the physical bus. It is primarily intended for high-speed automotive applications (up to 1 MBd). The device provides differential transmit capability to the bus and differential receive capability to the CAN controller. It is fully compatible with the "ISO 11898" standard. A current limiting circuit protects the transmitter output stage against short-circuit to positive and negative battery voltage. Although the power dissipation is increased during this fault condition, this feature will prevent destruction of the transmitter output stage. If the junction temperature exceeds a value of approximately 160 C, the limiting current of both transmitter outputs is decreased. Because the transmitter is responsible for the major part of the power dissipation, this will result in reduced power dissipation and hence a lower chip temperature. All other parts of the PCA82C250 will remain in operation. The thermal protection is needed, in particular, when a bus line is short-circuited. The CANH and CANL lines are also protected against electrical transients which may occur in an automotive environment. Pin 8 (Rs) allows three different modes of operation to be selected: High-speed, Slope control and Standby. For high-speed operation, the transmitter output transistors are simply switched on and off as fast as possible. In this mode, no measures are taken to limit the rise and fall slope. Use of a shielded cable is recommended to avoid RFI problems. The High-speed mode is selected by connecting pin 8 to ground. For lower speeds or shorter bus length, an unshielded twisted pair or a parallel pair of wires can be used for the bus. To reduce RFI, the rise and fall slope should be limited. The rise and fall slope can be programmed with a resistor connected from pin 8 to ground. The slope is proportional to the current output at pin 8. If a HIGH level is applied to pin 8, the circuit enters a low-current Standby mode. In this mode, the transmitter is switched off and the receiver is switched to a low current. If dominant bits are detected (differential bus voltage >0.9 V), RXD will be switched to a
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CAN controller interface
LOW level. The microcontroller should react to this condition by switching the transceiver back to normal operation (via pin 8). Because the receiver is slow in Standby mode, the first message will be lost.
Table 4. Supply 4.5 V to 5.5 V 4.5 V to 5.5 V < 2 V (not powered) 2 V < VCC < 4.5 V 2 V < VCC < 4.5 V
[1] X = don't care.
Truth table of the CAN transceiver TXD 0 X[1] >0.75VCC X[1] CANH HIGH floating floating floating if VRs > 0.75VCC CANL LOW floating floating floating Bus state dominant recessive recessive recessive RXD 0 1 X[1] X[1] X[1]
1 (or floating) floating
floating if recessive VRs > 0.75VCC
Table 5.
Pin Rs summary Mode Standby Slope control High-speed Resulting voltage or current at pin Rs IRs < |10 A| 0.4VCC < VRs < 0.6VCC IRs < -500 A
Condition forced at pin Rs VRs > 0.75VCC -10 A < IRs < -200 A VRs < 0.3VCC
9. Limiting values
Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to pin 2; positive input current. Symbol Parameter VCC Vn V6, 7 Vtrt Tstg Tamb Tvj Vesd supply voltage DC voltage at pins 1, 4, 5 and 8 DC voltage at pins 6 and 7 transient voltage at pins 6 and 7 storage temperature ambient temperature virtual junction temperature electrostatic discharge voltage
[1] [2] [3]
Conditions
Min -0.3 -0.3
Max +9.0 +18.0 +100 +150 +125 +150 +2000 +200
Unit V V V C C C V V
VCC + 0.3 V
0 V < VCC < 5.5 V; no time limit see Figure 8
-8.0 -150 -55 -40 -40 -2000 -200
[1]
In accordance with "IEC 60747-1". An alternative definition of virtual junction temperature is: Tvj = Tamb + Pd x Rth(vj-a), where Rth(j-a) is a fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable combinations of power dissipation (Pd) and ambient temperature (Tamb). Classification A: human body model; C = 100 pF; R = 1500 ; V = 2000 V. Classification B: machine model; C = 200 pF; R = 25 ; V = 200 V.
[2] [3]
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Product data sheet
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CAN controller interface
10. Thermal characteristics
Table 7. Symbol Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to ambient Conditions in free air Typ 160 Unit K/W
11. Characteristics
Table 8. Characteristics VCC = 4.5 to 5.5 V; Tamb = -40 to +125 C; RL = 60 ; I8 > -10 A; unless otherwise specified; all voltages referenced to ground (pin 2); positive input current; all parameters are guaranteed over the ambient temperature range by design, but only 100 % tested at +25 C. Symbol Parameter Supply I3 supply current dominant; V1 = 1 V recessive; V1 = 4 V; R8 = 47 k recessive; V1 = 4 V; V8 = 1 V Standby; Tamb < 90 C DC bus transmitter VIH VIL IIH IIL V6,7 ILO V7 V6 V6, 7 HIGH-level input voltage LOW-level input voltage HIGH-level input current LOW-level input current recessive bus voltage off-state output leakage current CANH output voltage CANL output voltage difference between output voltage at pins 6 and 7 output recessive output dominant V1 = 4 V V1 = 1 V V1 = 4 V; no load -2 V < (V6,V7) < 7 V -5 V < (V6,V7) < 18 V V1 = 1 V V1 = 1 V V1 = 1 V V1 = 1 V; RL = 45 ; VCC 4.9 V V1 = 4 V; no load Isc7 Isc6 Vdiff(r) short-circuit CANH current short-circuit CANL current differential input voltage (recessive) differential input voltage (dominant) differential input hysteresis HIGH-level output voltage V7 = -5 V; VCC 5 V V7 = -5 V; VCC = 5.5 V V6 = 18 V 0.7VCC -0.3 -200 -100 2.0 -2 -5 2.75 0.5 1.5 1.5 -500 -1.0 -7 V < (V6, V7) < 12 V; not Standby mode -7 V < (V6, V7) < 12 V; not Standby mode see Figure 5 pin 4; I4 = -100 A -1.0 0.9 1.0 0.8VCC 150 VCC + 0.3 V 0.3VCC +30 -600 3.0 +1 +12 4.5 2.25 3.0 +50 -105 -120 160 +0.5 +0.4 5.0 5.0 VCC V A A V mA mA V V V V mV mA mA mA V V V V mV V
[1]
Conditions
Min -
Typ 100
Max 70 14 18 170
Unit mA mA mA A
DC bus receiver: V1 = 4 V; pins 6 and 7 externally driven; -2 V < (V6, V7) < 7 V; unless otherwise specified
Vdiff(d)
Vdiff(hys) VOH
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Product data sheet
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CAN controller interface
Table 8. Characteristics ...continued VCC = 4.5 to 5.5 V; Tamb = -40 to +125 C; RL = 60 ; I8 > -10 A; unless otherwise specified; all voltages referenced to ground (pin 2); positive input current; all parameters are guaranteed over the ambient temperature range by design, but only 100 % tested at +25 C. Symbol Parameter VOL Ri Rdiff Ci Cdiff Vref LOW-level output voltage input resistance differential input resistance input capacitance differential input capacitance reference output voltage V8 = 1 V; -50 A < I5 < 50 A V8 = 4 V; -5 A < I5 < 5 A Timing (see Figure 4, Figure 6 and Figure 7 tbit tonTXD toffTXD tonRXD toffRXD bit time delay TXD to bus active delay TXD to bus inactive delay TXD to receiver active delay TXD to receiver inactive minimum; V8 = 1 V V8 = 1 V V8 = 1 V V8 = 1 V V8 = 1 V; VCC < 5.1 V; Tamb < +85 C V8 = 1 V; VCC < 5.1 V; Tamb < +125 C V8 = 1 V; VCC < 5.5 V; Tamb < +85 C V8 = 1 V; VCC < 5.5 V; Tamb < +125 C tonRXD toffRXD |SR| tWAKE tdRXDL V8 I8 Vstb Islope Vslope
[1]
Conditions pin 4; I4 = 1 mA I4 = 10 mA CANH, CANL CANH, CANL
Min 0 0 5 20 -
Typ -
Max 0.2VCC 1.5 25 100 20 10 0.55VCC 0.6VCC 1 50 80 120 150 170 170 190 520 320 450 320 20 3 0.3VCC -500 -200 0.6VCC
Unit V V k k pF pF V V s ns ns ns ns ns ns ns ns ns ns ns V/s s s V A V A V
Reference output 0.45VCC 0.4VCC V8 = 0 V -10 0.4VCC 40 55 82 82 90 90 390 260 260 210 14 -
delay TXD to receiver active delay TXD to receiver inactive differential output voltage slew rate wake-up time from standby bus dominant to RXD LOW input voltage for high-speed input current for high-speed input voltage for standby mode slope control mode current slope control mode voltage
R8 = 47 k R8 = 24 k R8 = 47 k R8 = 24 k R8 = 47 k via pin 8 V8 = 4 V; Standby mode
Standby/Slope Control (pin 8)
0.75VCC -
I1 = I4 = I5 = 0 mA; 0 V < V6 < VCC; 0 V < V7 < VCC; V8 = VCC.
PCA82C250_6
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Product data sheet
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PCA82C250
CAN controller interface
+5 V
100 pF
VCC TXD CANH
PCA82C250
Vref
62 100 pF
RXD GND
30 pF
CANL Rs
Rext
mka671
Fig 3.
Test circuit for dynamic characteristics.
VCC VTXD 0V
0.9 V Vdiff 0.5 V
VRXD 0.3VCC tonTXD tonRXD toffTXD toffRXD
0.7VCC
mka672
Fig 4.
Timing diagram for dynamic characteristics.
VRXD HIGH
LOW hysteresis
0.5 V
0.9 V
Vdiff
mka673
Fig 5.
Hysteresis.
PCA82C250_6
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Product data sheet
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CAN controller interface
VCC VRs 0V
VRXD
tWAKE
mka674
V1 = 1 V.
Fig 6.
Timing diagram for wake-up from Standby.
1.5 V Vdiff 0V
VRXD
tdRXDL
mka675
V1 = 4 V; V8 = 4 V.
Fig 7.
Timing diagram for bus dominant to RXD LOW.
+5 V VCC TXD CANH
1 nF
PCA82C250
RXD
62 1 nF
SCHAFFNER GENERATOR
Vref GND Rs
CANL
Rext
mka676
The waveforms of the applied transients shall be in accordance with "ISO 7637 part 1", test pulses 1, 2, 3a and 3b.
Fig 8.
Test circuit for automotive transients.
PCA82C250_6
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CAN controller interface
12. Application information
P8xC592/P8xCE598
CAN-CONTROLLER CTX0 CRX0 CRX1 PX,Y
Rext
+5 V TXD RXD Vref Rs VCC
PCA82C250T
CAN-TRANSCEIVER GND CANH CANL
100 nF
124
CAN BUS LINE
124
mka677
Fig 9.
Application of the CAN transceiver.
SJA1000
CAN-CONTROLLER TX0 TX1
6.8 k
RX0
RX1
3.6 k
+5 V
390
VDD
390
100 nF
6N137
VSS 0V
6N137
390
100 nF
+5 V
390
+5 V TXD RXD Vref Rs VCC +5 V
PCA82C250
CAN-TRANSCEIVER GND CANH CANL
100 nF
Rext
124
CAN BUS LINE
124
mka678
Fig 10. Application with galvanic isolation.
PCA82C250_6
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Product data sheet
Rev. 06 -- 26 March 2009
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PCA82C250
CAN controller interface
VCC 3
TXD
1
Rs
8
RXD
4
7
CANH CANL
PCA82C250
Vref 5 6
2 GND
mka679
Fig 11. Internal pin configuration.
PCA82C250_6
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Product data sheet
Rev. 06 -- 26 March 2009
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PCA82C250
CAN controller interface
13. Package outline
SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
D
E
A X
c y HE vMA
Z 8 5
Q A2 A1 pin 1 index Lp 1 e bp 4 wM L detail X (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 0.069 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 5.0 4.8 0.20 0.19 E (2) 4.0 3.8 0.16 0.15 e 1.27 0.05 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.7 0.3 0.028 0.012
0.010 0.057 0.004 0.049
0.019 0.0100 0.014 0.0075
0.244 0.039 0.028 0.041 0.228 0.016 0.024
8o o 0
Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION SOT96-1 REFERENCES IEC 076E03 JEDEC MS-012 JEITA EUROPEAN PROJECTION
ISSUE DATE 99-12-27 03-02-18
Fig 12. Package outline SOT96-1 (SO8)
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CAN controller interface
14. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 "Surface mount reflow soldering description".
14.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization.
14.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following:
* Through-hole components * Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are:
* * * * * *
Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus SnPb soldering
14.3 Wave soldering
Key characteristics in wave soldering are:
* Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are exposed to the wave
* Solder bath specifications, including temperature and impurities
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CAN controller interface
14.4 Reflow soldering
Key characteristics in reflow soldering are:
* Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 13) than a SnPb process, thus reducing the process window
* Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
* Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 9 and 10
Table 9. SnPb eutectic process (from J-STD-020C) Package reflow temperature (C) Volume (mm3) < 350 < 2.5 2.5 Table 10. 235 220 Lead-free process (from J-STD-020C) Package reflow temperature (C) Volume (mm3) < 350 < 1.6 1.6 to 2.5 > 2.5 260 260 250 350 to 2000 260 250 245 > 2000 260 245 245 350 220 220
Package thickness (mm)
Package thickness (mm)
Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 13.
PCA82C250_6
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Product data sheet
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CAN controller interface
temperature
maximum peak temperature = MSL limit, damage level
minimum peak temperature = minimum soldering temperature
peak temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 13. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365 "Surface mount reflow soldering description".
PCA82C250_6
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Product data sheet
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CAN controller interface
15. Revision history
Table 11. Revision history Release date 20090326 Data sheet status Product data sheet Change notice Supersedes PCA82C250_5 Document ID PCA82C250_6 Modifications:
* * *
The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. DIP8 package discontinued; bare die no longer available. Product specification Preliminary specification PCA82C250_3 PCA82C250_2 PCA82C250_1 -
PCA82C250_5 PCA82C250_3 PCA82C250_2 PCA82C250_1
20000113 19971021 19940915 19940408
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16. Legal information
16.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data -- The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.
16.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
17. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
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Product data sheet
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CAN controller interface
18. Contents
1 2 3 4 5 6 7 7.1 7.2 8 9 10 11 12 13 14 14.1 14.2 14.3 14.4 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Thermal characteristics. . . . . . . . . . . . . . . . . . . 5 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Application information. . . . . . . . . . . . . . . . . . . 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 Soldering of SMD packages . . . . . . . . . . . . . . 12 Introduction to soldering . . . . . . . . . . . . . . . . . 12 Wave and reflow soldering . . . . . . . . . . . . . . . 12 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 12 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 16 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Contact information. . . . . . . . . . . . . . . . . . . . . 16 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 26 March 2009 Document identifier: PCA82C250_6

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